Chinese semiconductor IDM company ChangXin Memory Technologies, Inc. (CXMT) announced that it is currently using the 19nm process to produce 4GB and 8GB DDR4 memory chips, and plans to market in the first quarter of 2020. In addition, CXMT will also use the same 19nm technology to manufacture LPDDR4X memory in the second half of 2020.
According to reports, in terms of DRAM capacity, CXMT currently has more than 3,000 employees and a fab with a 65,000 square meters clean room. The current monthly production capacity is about 20,000 wafers. It will use 10G1 technology to increase the monthly production capacity to 40,000 wafers. By the end of 2020, the wafer production capacity of its 10nm process technology will reach 120,000 wafers (12 inches), which is comparable to SK Hynix’s factory in Wuxi, China. In addition, CXMT plans to build two more DRAM fabs to meet production needs.