SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Microchip's new Bluetooth® 5.0 dual-mode solution helps reduce BOM in wireless audio design
  • 0

Microchip's new Bluetooth® 5.0 dual-mode solution helps reduce BOM in wireless audio design

SemiMediaEdit
October 11, 2019

Microchip Technology recently announced its next-generation Bluetooth 5.0-qualified dual-mode audio IC and fully certified modules to help Bluetooth® speaker and headset manufacturers maintain product differentiation in the competitive wireless audio market.

Measuring just 5.5 x 5.5 mm, the low-power IS2083BM IC is ideal for small form factor designs and gives developers more space to use larger batteries in end products. Both the IS2083BM IC and BM83 module enable customers to reduce Bill of Materials (BOM) with highly integrated features, including:

  • Embedded Mode:Eliminates the need for an external host MCU to support application functionality
  • Integrated Power Amplifier: The integrated power amplifier includes up to +9.5 dBm output power, removing the need for an external power amplifier
  • Large Flash memory: With an integrated 2 Mbyte Flash memory, this feature provides the ability to store updated files during over-the-air (OTA) updates and software settings without external storage
  • Support for Sony’s LDAC™ audio codec technology: This technology extends high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products

The IS2083BM IC and BM83 module also integrate Bluetooth Low Energy (BLE) Data Length Extension (DLE) and LE Secure Connection (LE SC) that enables approximately 2.5 times higher data throughput and improved security when transmitting data such as during firmware updates.

The IS2083BM IC and BM83 come with a suite of development tools, Microchip’s mobile application and example codes for rapid development. For more information on this product, please visit Microchip's website: www.microchip.com

 

Related

Electronic components IS2083BM Microchip Bluetooth 5.0 solution
Samsung considers increasing investment in its semiconductor factory in China
Previous
IHS Markit: 5G will reverse the downturn in the semiconductor market
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

July 4, 2025
0
ROHM launches 100V MOSFET with wide SOA for AI server power systems

ROHM launches 100V MOSFET with wide SOA for AI server power systems

July 2, 2025
0
Codasip seeks buyer amid growing pressure in RISC-V processor market

Codasip seeks buyer amid growing pressure in RISC-V processor market

July 2, 2025
0
TDK launches high-temp 6-axis automotive IMU for cabin applications

TDK launches high-temp 6-axis automotive IMU for cabin applications

July 1, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator