SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › UnitedSiC and ADI have signed strategic investments and long-term supply agreements
  • 0

UnitedSiC and ADI have signed strategic investments and long-term supply agreements

SemiMediaEdit
March 21, 2019

Today, SiC power semiconductor manufacturer UnitedSiC announced a strategic investment and long-term supply agreement with Analog Devices, the specific terms have not been announced.

In the past two years, UnitedSiC and ADI have been working together to develop SiC-based products and equipment. As wideband-gap power devices become more mainstream technologies, especially the development of SiC technology, making them more cost-effective, the introduction of these devices will further enhance ADI's analog power portfolio.

Chris Dries, President and CEO of UnitedSiC, said: "Since our first meeting with the ADI power team, they immediately realized the value of our SiC technology and the ease with which SiC devices can be expanded and used in their power platforms. It's a great time to make high-quality leaders like ADI a shareholder in our company."

Steve Pietkiewicz, senior vice president of power products at ADI, said: "In the past few years, we have been actively focusing on the development of silicon carbide technology and devices. We have found that UnitedSiC's FET technology is well suited for ADI's high performance power platforms and our target applications in other high voltage markets."

Related

ADI electronic components news UnitedSiC
ST's view of three trends in MEMS sensors
Previous
The decline in NAND contract price in the second quarter is expected to slow down
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Western Digital speeds deleveraging with SanDisk share sale

Western Digital speeds deleveraging with SanDisk share sale

February 19, 2026
0
UK chip startup Fractile to invest £100m to scale AI hardware production

UK chip startup Fractile to invest £100m to scale AI hardware production

February 18, 2026
0
Winbond expects up to 95% DRAM price jump as DDR4 shortage deepens

Winbond expects up to 95% DRAM price jump as DDR4 shortage deepens

February 18, 2026
0
TrendForce sees memory market topping foundry revenue in 2026 on AI server demand

TrendForce sees memory market topping foundry revenue in 2026 on AI server demand

February 17, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator