SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Intel chip was found to have new vulnerabilities
  • 0

Intel chip was found to have new vulnerabilities

SemiMediaEdit
August 16, 2018

Following the Meltdown and Spectre vulnerabilities at the beginning of this year, Intel recently revealed its new vulnerability, Foreshadow, which is the third major vulnerability in Intel chips this year. The vulnerability is said to affect the Core and Xeon processors released since 2015.

According to reports, an attacker can exploit this vulnerability to bypass the built-in chip security features to obtain sensitive data stored in the "secure blockade" of the processor. The main target is the level 1 cache, which is rated as "high risk." If to count in the variants of the Meltdown and Spectre vulnerabilities, this is the fifth major vulnerability in x86 processors this year.In addition, the researchers discovered two similar variants called "Foreshadow-NG." They also attack code, operating systems, hypervisor software, and other microprocessors.

The Meltdown and Spectre vulnerabilities at the beginning of this year have caused many consumers to switch to the AMD platform. The main reason is that after patching the patch, the CPU performance drops significantly. Regarding the Foreshadow vulnerability patch, Intel said that the patch will not have a significant impact on platform performance. In addition, Intel also stressed that the new Xeon and the new Core will be launched before the end of the year, and these new products will be immune to this vulnerability from the bottom of the hardware.

Related

Electronic component news Intel new vulnerabilities
Analog Devices Introduces a Dual 10A or Single 20A Ultrathin Step-Down μModule® Regulator
Previous
Texas Instruments plans to build a new factory
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay launches VOx619A optocouplers with 0.5 mA drive current

Vishay launches VOx619A optocouplers with 0.5 mA drive current

March 4, 2026
0
NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

February 26, 2026
0
SK hynix says memory market turns seller-driven, prices seen rising through 2026

SK hynix says memory market turns seller-driven, prices seen rising through 2026

February 24, 2026
0
Infineon rolls out isolated gate drivers to support next wave of SiC power systems

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

February 12, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator