SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Toshiba's new fab breaks ground
  • 0

Toshiba's new fab breaks ground

SemiMediaEdit
July 27, 2018

Recently, Toshiba's new semiconductor fab announced its groundbreaking. The plant is located in the north of Iwate Prefecture in northeastern Japan. It is scheduled to be completed in the fall of 2019 and will be put into production by the end of 2020. It is reported that the K1 plant will specialize in the production of BiCS 3D flash memory.

Toshiba's new fab breaks ground-SemiMedia

The K1 plant will be Toshiba's largest, most advanced and highest-capacity flash memory plant. It is constructed with an isolated structure that absorbs seismic shocks and will introduce advanced production systems that use artificial intelligence to increase productivity. Toshiba Memory Corp will make decisions on equipment investment, capacity and production planning based on market trends to gain greater market competitiveness.

Toshiba is expected to discuss with Western Digital for joint investment in the new plant, but as of now, Western Digital has not released any related statements.

At present, Toshiba's main flash memory factory is Fab 6, located in Yokkaichi, Mie Prefecture, and Western Digital has participated in the cooperation. The first phase of the Fab6 project will begin operations this year and will help increase the supply of BICS 3D NAND. The second phase will be launched in 2019.

With the rapid growth of demand for servers and data centers, the demand for 3D flash memory has also increased significantly. Toshiba predicts that this strong growth momentum will be maintained in the medium to long term, and building this new fab will enhance its competitiveness in the storage sector. In view of the current supply side, although the demand is rising, the flash memory capacity in the next few years is very guaranteed, especially the gradual promotion of QLC will further lower the price of SSD.

Related

3D flash memory Electronic component news new fab Toshiba
Qualcomm has no choice but to give up the acquisition of NXP
Previous
Tsinghua Unigroup acquires French company Linxens
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Intel shifts foundry focus to 14A process

Intel shifts foundry focus to 14A process

July 3, 2025
0
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

July 3, 2025
0
Samsung delays 1.4nm production, focuses on 2nm and mature node efficiency

Samsung delays 1.4nm production, focuses on 2nm and mature node efficiency

July 3, 2025
0
TrendForce sees possible pullback in DDR4 prices in Q4

TrendForce sees possible pullback in DDR4 prices in Q4

July 2, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator