SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Tsinghua Unigroup acquires French company Linxens
  • 0

Tsinghua Unigroup acquires French company Linxens

SemiMediaEdit
July 27, 2018

According to reports, China's largest chip maker Tsinghua Unigroup (Unigroup) plans to acquire French smart card device manufacturer Linxens for about 2.2 billion euros. The contract between the two parties has been signed and is currently awaiting the consent of the French and German regulators and the company's trade unions.

Although the above transaction has been signed for more than a month, neither side has responded to this.

It is understood that Linxens was founded in 1979 and is headquartered in Paris, producing connectors that are critical to smart card and e-reader communications. Linxens also produces antenna and smart card pre-lamination products (inlays) for applications such as contactless payment and access. According to reports, Linxens has annual sales of 535 million euros and employs 3,500 people at nine production sites around the world. In addition, the company is a world-class provider of component-based solutions for the security and authentication markets, including RFID, biometrics, secure identity, dLoc, etc., for financial, Internet of Things, communications, transportation, and medical applications. And other fields.

According to the prediction of foreign research institutions, by 2019, the network security market is expected to grow to 155.74 billion US dollars, of which the identity authentication information security market will exceed 30 billion US dollars.

Currently, Unigroup and Linxens have not made any statement on the merger, but this will be Unicon's first successful overseas acquisition in the past two years.

Related

Linxens Mergers and acquisitions Tsinghua Unigroup
Toshiba's new fab breaks ground
Previous
NXP said it received Qualcomm's termination notice
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

8-inch wafer foundry capacity tightens in 2026 as utilization rises

8-inch wafer foundry capacity tightens in 2026 as utilization rises

January 16, 2026
0
2025 semiconductor revenue reaches $793 billion as AI demand accelerates

2025 semiconductor revenue reaches $793 billion as AI demand accelerates

January 16, 2026
0
South Korea pushes SiC and GaN power chips in foundry drive

South Korea pushes SiC and GaN power chips in foundry drive

January 15, 2026
0
SK hynix plans advanced packaging plant in Cheongju for HBM production

SK hynix plans advanced packaging plant in Cheongju for HBM production

January 15, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator