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Infineon: Producing chips in multiple locations facilitates the resilience and long-term growth of the semiconductor supply chain.
Infineon introduces new battery management ICs with excellent measurement performance and optimized battery life
Infineon releases new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility
Winbond and Infineon collaborate on HYPERRAM 3.0 to double bandwidth for IoT applications
Infineon introduces industry's first space-qualified serial interface F-RAM, providing 2 Mb density non-volatile storage for extreme environments
Infineon to double its packaging and testing capacity in Indonesia
Infineon launches complete power management solution for next-generation Intel Xeon processors
Infineon launches new automotive 750 V EDT2 IGBT in TO247PLUS package for discrete traction inverters
Infineon OptiMOS™ 5 25 V and 30 V solutions in PQFN 2x2 set new form factor, on-state resistance and switching performance standards
Infineon to spend $700 million to expand Austin fab
infineon to raise investment to 2.4 billion euros in 2022
Infineon’s new MERUS™ class D audio amplifier multichip module enables small footprint, high power density, and heatsink-free operation
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