SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TSMC and Sony considering joint chip fab
  • 0

TSMC and Sony considering joint chip fab

SemiMediaEdit
October 11, 2021

According to reports, TSMC and Sony are considering a joint investment of approximately US$7 billion to build a semiconductor fab in western Japan.

The report pointed out that the fab will be located in Kumamoto Prefecture, adjacent to Sony's current image sensor factory. Sony will be the main customer of this new fab and will hold a minority stake in the semiconductor factory management company established by TSMC.

The fab will be used to produce camera image sensors, as well as chips used in automobiles and other products, and is scheduled to be put into operation in 2023 or 2024.

Related

electronic components news SONY TSMC
TDK launches miniaturized, high-sensitivity MEMS pressure sensor element
Previous
GlobalWafers: Silicon wafer production lines are fully loaded
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Amkor expands Arizona packaging plans as AMD joins advanced packaging customers

Amkor expands Arizona packaging plans as AMD joins advanced packaging customers

May 22, 2026
0
Vishay launches automotive-grade optocouplers for EV and high-voltage isolation systems

Vishay launches automotive-grade optocouplers for EV and high-voltage isolation systems

May 22, 2026
0
Infineon expands CoolGaN BDS portfolio with compact 40 V bidirectional GaN switches

Infineon expands CoolGaN BDS portfolio with compact 40 V bidirectional GaN switches

May 21, 2026
0
Samsung Electronics reaches last-minute labor deal ahead of planned strike

Samsung Electronics reaches last-minute labor deal ahead of planned strike

May 21, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator