SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TSMC and Sony considering joint chip fab
  • 0

TSMC and Sony considering joint chip fab

SemiMediaEdit
October 11, 2021

According to reports, TSMC and Sony are considering a joint investment of approximately US$7 billion to build a semiconductor fab in western Japan.

The report pointed out that the fab will be located in Kumamoto Prefecture, adjacent to Sony's current image sensor factory. Sony will be the main customer of this new fab and will hold a minority stake in the semiconductor factory management company established by TSMC.

The fab will be used to produce camera image sensors, as well as chips used in automobiles and other products, and is scheduled to be put into operation in 2023 or 2024.

Related

electronic components news SONY TSMC
TDK launches miniaturized, high-sensitivity MEMS pressure sensor element
Previous
GlobalWafers: Silicon wafer production lines are fully loaded
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

July 4, 2025
0
TSMC exits GaN foundry business as Navitas shifts to PSMC

TSMC exits GaN foundry business as Navitas shifts to PSMC

July 4, 2025
0
Intel shifts foundry focus to 14A process

Intel shifts foundry focus to 14A process

July 3, 2025
0
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

July 3, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator