September 29, 2026 / SemiMedia / — VisionPower Semiconductor Manufacturing Company, the joint venture between Vanguard International Semiconductor and NXP Semiconductors, has opened its first 300mm wafer fab in Tampines, Singapore. The approximately $7.8 billion facility has entered risk production, with volume manufacturing scheduled to begin in the first quarter of 2027.

VSMC is 60% owned by Vanguard and 40% by NXP. The joint venture was established in September 2024 and broke ground in December of that year. Construction was completed in about 22 months, with roughly 200 pieces of manufacturing equipment now moving through commissioning and trial operation.

The fab will support process technologies from 130nm to 40nm for mixed-signal, power management, analog and silicon interposer products serving automotive, industrial, consumer, mobile and high-performance computing applications. VSMC produced its first 40nm trial wafers in June, achieving yields above 99%.

Vanguard said the first phase of capacity has already been fully allocated to customers, while additional demand has emerged for interposer products. The committed capacity could allow the fab to ramp utilization faster than originally expected and reach break-even earlier.

At full utilization, VSMC currently expects the plant to produce approximately 44,000 300mm wafers per month by 2029. This is below the original target of 55,000 wafers per month, although the company is adjusting its product mix toward higher-value applications and could complete the overall capacity ramp ahead of the original schedule.

With first-phase capacity already committed, Vanguard has begun evaluating a second 300mm fab in Singapore. Future expansion could also include 28nm or 22nm technologies as the company targets additional demand from automotive, industrial, advanced packaging and AI-related specialty semiconductor applications.