August 20, 2025 /SemiMedia/ — Competition in the global semiconductor foundry industry is intensifying as chipmakers race to advance their 2nm technology. Taiwan Semiconductor Manufacturing Co (TSMC) has set the price of its 2nm wafers at around $30,000 each, applying a strict “no discount, no negotiation” policy. The price represents a 50% to 66% increase compared with its current 3nm offering.

TSMC plans to begin initial production within the next three years, starting with a monthly output of 30,000 to 35,000 wafers. Capacity is expected to expand to about 60,000 wafers per month by 2026 as new fabs come online. While early yields are projected at around 60%, SRAM yields are expected to exceed 90%, a level sufficient for mass production. Analysts note that the pricing strategy is designed not only to reflect costs but also to allocate limited early capacity to high-value markets such as high-performance computing (HPC) and artificial intelligence (AI).

Samsung, meanwhile, is reported to be struggling with 2nm yields of about 40% and slower process maturity. To regain credibility, the company is pursuing a lower pricing strategy and rapid response to customer needs. Despite ongoing quarterly losses in its foundry division, Samsung aims to strengthen trust in its 3nm GAA process and build a base of U.S. and European clients, laying groundwork for broader 2nm adoption in the future.