SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TSMC may acquire memory chip company
  • 0

TSMC may acquire memory chip company

SemiMediaEdit
September 7, 2018

According to reports, Mark Liu, chairman of TSMC, said during the SEMICON exhibition that TSMC may acquire a memory chip company, but there is no set target yet.

Market watchers say that acquiring memory chip manufacturing capabilities will benefit TSMC, as future chip designs may incorporate more features to improve performance and efficiency.

In fact, TSMC has not conducted a large-scale merger and acquisition case so far. A senior industry insider speculates that the current global memory chip market is dominated by Samsung, SK Hynix, and Micron. According to his assessment, TSMC is unlikely to acquire Samsung and other two major manufacturers. In addition to the three major players, Nanya, MXIC and Winbond are major producers in Taiwan. Among them, Nanya may be a potential partner or investment object of TSMC, but Nanya said that it did not receive any acquisition information and declined to comment. On the other hand, some insiders speculated that TSMC and Micron may jointly establish a joint venture.

In the past two years, there has been a shortage of various electronic components, but it is recognized that the problem caused by the shortage of memory is the most serious. Without a memory chip, no electronic technology product can be intelligent. It can be seen that the memory chip will become more and more important in the field of science and technology in the future.

Related

Acquisition Electronic component news TSMC
Yageo again releases MLCC price adjustment notice
Previous
Infineon’s answer for lighting applications - 950 V CoolMOS P7
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator