SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases compact high-current choke coils for automotive and industrial applications
  • 0

TDK releases compact high-current choke coils for automotive and industrial applications

SemiMediaEdit
March 20, 2023

Mar. 20, 2023 /SemiMedia/ -- TDK Corporation has recently released the B82559A*A033 series of new shielded EPCOS ERU33 high-current choke coils for through-hole mounting. Designed for very high saturation currents from 32 A to 83 A at 100 °C, the six new types cover a range of inductance values from 3.2 µH to 10 µH. DC resistances are as low as 0.85 mΩ or 1.2 mΩ, depending on the type. Thanks to the flat wire winding, the chokes have very compact dimensions of only 33 x 33 x 15 mm. By thermally connecting the flat wire winding to the core, the large ferrite surface can be coupled to a heat sink for effective heat dissipation. In addition to the standard types, customized variants with other inductance values can also be realized.

The RoHS-compatible and AEC-Q200 REV D-qualified inductors are designed for operating temperatures from -40 °C to +150 °C. Typical automotive applications are buck-boost chokes for DC-DC converters (e.g. for 48 V on-board power supplies or differential mode chokes in the input filter of onboard chargers. In industrial electronics, they can be used as storage and output chokes in high-current supplies and PoL supplies.

For more information, please visit www.tdk-electronics.tdk.com/en/eru_chokes.

Related

B82559A*A033 electronic components news Electronic components supplier Electronic parts supplier TDK
Chip lead times continue to shorten
Previous
Murata announced joint venture company for the production of MLCC raw materials
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay introduces automotive 1 MBd high speed optocoupler

Vishay introduces automotive 1 MBd high speed optocoupler

July 15, 2026
0
PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

July 15, 2026
0
Tower Semiconductor to invest $3 billion in Japan chip manufacturing

Tower Semiconductor to invest $3 billion in Japan chip manufacturing

July 15, 2026
0
Bosch begins sample production at first U.S. silicon carbide chip fab

Bosch begins sample production at first U.S. silicon carbide chip fab

July 14, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator