SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TDK plan to build new MLCC factory
  • 0

TDK plan to build new MLCC factory

SemiMediaEdit
May 12, 2022

According to Nikkei, TDK plans to spend about 50 billion yen ($383 million) to build a factory in Japan to make parts for electric vehicles.

The new factory, located next to an existing plant in Kitakami, Iwate Prefecture, Japan, will produce multilayer ceramic capacitors (MLCCs) and is scheduled to be completed and put into operation by the end of 2024, the report noted.

TDK plans to double the output of capacitors, but has not disclosed specifics. However, the construction of the new factory is the largest investment TDK has ever made in expanding production capacity of electronic components, and it is TDK's first new capacitor factory in the past 16 years.

Nikkei also noted that electric vehicles are expected to increase demand for capacitors. Each electric car requires about 10,000 capacitors, about twice as many as gasoline cars. In addition, global electric vehicle sales will reach 35.44 million units by 2030, an increase of more than 7 times from 2021.

Related

electronic components news Nikkei TDK MLCC factory
Onsemi Shenzhen is said to have sold two years capacity
Previous
Diodes Inc. introduces high efficiency low voltage 3A buck converter for high power density automotive designs
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator