SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules
  • 0

TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules

SemiMediaEdit
May 12, 2020

TAIYO YUDEN recently announced the launch of wireless communications modules EYSNCNZWW (9.6x12.9x2.0 mm) and EYSNSNZWW (3.25x8.55x1.00 mm). Both are compatible with Core Specification version 5.2, which is the latest version of Bluetooth® 5.

These products support a direction-finding function that enables users to grasp location information, and are most suitable for IoT-related devices that are required to be small and thin, such as wearable devices, healthcare equipment, and handheld devices for logistics.

TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules-SemiMedia

Availability
Mass production of the products will commence in May 2020, with a sample price of 3,000 yen per module.

Related

electronic components news Taiyo yuden Bluetooth module Taiyo Yuden wireless module
Vishay expands resistance range of MCA 1206 AT Precision series thin film chip resistors
Previous
SK Hynix cooperates with KAIST to improve IC manufacturing process
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator