Texas Instruments

TI lays off power chip R&D team in Beijing

TI lays off power chip R&D team in Beijing

February 29, 2024

Market demand rebound slower than expected, TI says

Market demand rebound slower than expected, TI says

January 25, 2024

TI expands low-power GaN portfolio, enabling AC/DC power adapters to shrink 50%

TI expands low-power GaN portfolio, enabling AC/DC power adapters to shrink 50%

December 1, 2023

TI to build a new 300mm fab in Utah

TI to build a new 300mm fab in Utah

February 17, 2023

Nikkei: TI plans to expand production capacity at Japan's Fukushima fab

Nikkei: TI plans to expand production capacity at Japan's Fukushima fab

February 16, 2023

TI: Weakness in all markets except automotive

TI: Weakness in all markets except automotive

January 26, 2023

TDK with TI on the world’s first sensor module with built-in edge AI and wireless mesh connectivity

TDK with TI on the world’s first sensor module with built-in edge AI and wireless mesh connectivity

January 10, 2023

TrendForce: Global production capacity of PMICs is expected to up 4.7%

TrendForce: Global production capacity of PMICs is expected to up 4.7%

January 9, 2023

TI announces partnership with Chicony Power to bring GaN technology to next-generation energy-efficient laptop power adapters

TI announces partnership with Chicony Power to bring GaN technology to next-generation energy-efficient laptop power adapters

December 21, 2022

TI announces expansion of space-grade portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space

TI announces expansion of space-grade portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space

November 30, 2022