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UK government orders FTDI Holding Ltd to sell FTDI shares
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Murata considers shifting some production capacity to India
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Infineon ships first SiC power devices using 200mm wafers
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ASE to expand semiconductor packaging capacity in Malaysia and Kaohsiung
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U.S. pushes for Intel and TSMC joint venture for chip foundries
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Arm to launch in-house chips in 2025
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Micron to begin mass production of 12-layer stack HBM for Nvidia
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SEMI: Global fab equipment spending expected to hit record $109 billion this year
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ST introduces new automotive gate drivers, increasing motor control flexibility
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Intel gets approval to supply Huawei
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