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Intel suspends investment in chip plants in France and Italy, report says
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Melexis announces opening of wafer testing facility in Malaysia
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Insider: OSAT increases capital expenditures to respond to growing demand for advanced packaging
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Vishay introduces new 890 nm IR emitting diode with high typical radiant intensity of 235 mW/sr and fast switching times of 15 ns
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TI introduces new magnetic packaging technology for power modules to reduce power solution size in half
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Nikkei: Japanese semiconductor manufacturers expand investment
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Forbes: Samsung union strike may affect global memory chip supply
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Samsung suspends construction of foundry production line at Pyeongtaek P4 plant, report says
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Intel's new wafer fab construction in Magdeburg, Germany delayed
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TDK introduces 400 to 750W rugged step-down DC-DC converters with conduction cooling and a wide range of input and output
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