Electronic parts supplier

Samsung to boost HBM capacity with new fab set for completion in 2027

Samsung to boost HBM capacity with new fab set for completion in 2027

November 13, 2024

Infineon announces collaboration with Stellantis on smart EV power architecture

Infineon announces collaboration with Stellantis on smart EV power architecture

November 12, 2024

onsemi unveils Treo Platform for advanced power and sensing solutions

onsemi unveils Treo Platform for advanced power and sensing solutions

November 12, 2024

Murata launches SCH1633-D01, a new benchmark for automotive 6DoF sensors

Murata launches SCH1633-D01, a new benchmark for automotive 6DoF sensors

November 11, 2024

Insider: TSMC halts supply of 7nm and advanced chips to Chinese mainland AI companies

Insider: TSMC halts supply of 7nm and advanced chips to Chinese mainland AI companies

November 11, 2024

ADI acquires eFPGA technology firm Flex Logix to expand digital product portfolio

ADI acquires eFPGA technology firm Flex Logix to expand digital product portfolio

November 11, 2024

Nexperia and KOSTAL announce strategic partnership to advance automotive-grade wide bandgap devices

Nexperia and KOSTAL announce strategic partnership to advance automotive-grade wide bandgap devices

November 8, 2024

Renesas introduces RA8 entry-line MCUs, bringing Arm Cortex-M85 performance to cost-sensitive applications

Renesas introduces RA8 entry-line MCUs, bringing Arm Cortex-M85 performance to cost-sensitive applications

November 8, 2024

Kioxia forecasts flash memory demand to grow 2.7 times by 2028

Kioxia forecasts flash memory demand to grow 2.7 times by 2028

November 8, 2024

Infineon releases new generation of GaN power discretes with superior efficiency and power density

Infineon releases new generation of GaN power discretes with superior efficiency and power density

November 7, 2024