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SEMI: Global fab equipment spending expected to recover in 2024
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Diodes Inc. releases 20Gbps 2x2 switch for fast multiplexing/switching in automotive media and driver assistance systems
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Tokyo Electronics to build a new semiconductor equipment factory in Japan
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onsemi launches latest 8-megapixel image sensor for superior 4K video quality
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Kyocera AVX announces joining the Nordic Partner Program
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Murata announced joint venture company for the production of MLCC raw materials
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TDK releases compact high-current choke coils for automotive and industrial applications
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Chip lead times continue to shorten
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Silicon Labs introduces new bluetooth SoC and MCU for small form-factor devices
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China's chip output falls in first two months of 2023
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