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Murata releases new wireless modules delivering enhanced performance for IoT implementations
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PSMC plans to build a fab in Japan
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TDK releases new embedded motor controller for driving BLDC and BDC motors
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ROHM plans to pay $2.16 billion for Toshiba acquisition
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Infineon expands CoolSiC™ MOSFET family for better thermal performance, power density and easier assembly
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Stellantis announces strategic cooperation with chip makers to secure long-term supply
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Infineon introduces industry's first 1Mbit automotive-grade serial EXCELON™ F-RAM and adds 4Mbit density
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YOLE: Global MCU shipments are expected to down 10% year-on-year in 2023
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Demand for automotive and industrial chips to remain steady in 2023
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TDK releases two new piezo actuators
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