Electronic components supplier

U.S. launches CHIPS ITSI Western Hemisphere Semiconductor Program to boost chip packaging capabilities in Latin America

U.S. launches CHIPS ITSI Western Hemisphere Semiconductor Program to boost chip packaging capabilities in Latin America

July 23, 2024

KYOCERA AVX releases 20 new KAM series automotive MLCCs

KYOCERA AVX releases 20 new KAM series automotive MLCCs

July 23, 2024

Amphenol to acquire CommScope's mobile network business

Amphenol to acquire CommScope's mobile network business

July 22, 2024

onsemi launches new SiC MOSFET to accelerate SiC innovation and power electrification transformation

onsemi launches new SiC MOSFET to accelerate SiC innovation and power electrification transformation

July 22, 2024

Intel suspends investment in chip plants in France and Italy, report says

Intel suspends investment in chip plants in France and Italy, report says

July 22, 2024

Melexis announces opening of wafer testing facility in Malaysia

Melexis announces opening of wafer testing facility in Malaysia

July 19, 2024

Insider: OSAT increases capital expenditures to respond to growing demand for advanced packaging

Insider: OSAT increases capital expenditures to respond to growing demand for advanced packaging

July 19, 2024

Vishay introduces new 890 nm IR emitting diode with high typical radiant intensity of 235 mW/sr and fast switching times of 15 ns

Vishay introduces new 890 nm IR emitting diode with high typical radiant intensity of 235 mW/sr and fast switching times of 15 ns

July 19, 2024

TI introduces new magnetic packaging technology for power modules to reduce power solution size in half

TI introduces new magnetic packaging technology for power modules to reduce power solution size in half

July 18, 2024

Nikkei: Japanese semiconductor manufacturers expand investment

Nikkei: Japanese semiconductor manufacturers expand investment

July 18, 2024