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Infineon releases high-Performance CIPOS™ Maxi Intelligent Power Module for industrial motor drives up to 4 kW
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ASE acquires new plant to expand advanced packaging capacity
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Samsung to produce 1γ DRAM next year, report says
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TI launches smallest TI DLP® display controller ever
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Polymatech acquires chip packaging and testing equipment company Nisene
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Infineon starts producing chips at its largest SiC factory
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Vishay introduces shielded IFDC and semi-Shielded IFSC series ferrite inductors in 2020DE, 3232DB, and 5050HZ case sizes
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SIA: Global semiconductor sales increased 18.3% year-on-year in the second quarter
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Nexperia launches new NextPower 80/100V MOSFET portfolio to provide greater design flexibility
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onsemi expects to produce 200mm SiC wafers by 2025
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