Electronic components supplier

Samsung to begin HBM4 tape-out by year-end, production expected late 2026
MarketWatch

Samsung to begin HBM4 tape-out by year-end, production expected late 2026

August 20, 2024
0
Infineon announces expansion of Bluetooth® portfolio with eight new products
Manufacturer

Infineon announces expansion of Bluetooth® portfolio with eight new products

August 19, 2024
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ESMC's first wafer fab will break ground on August 20
MarketWatch

ESMC's first wafer fab will break ground on August 20

August 19, 2024
0
Vishay's new silicon PIN photodiode enhances sensitivity in biomedical applications
Manufacturer

Vishay's new silicon PIN photodiode enhances sensitivity in biomedical applications

August 16, 2024
0
AI Shifts to Edge: Smartphones and PCs See Market Boom
MarketWatch

AI Shifts to Edge: Smartphones and PCs See Market Boom

August 16, 2024
0
u-blox launches new ultra-compact LTE Cat 1bis cellular module to empower global connectivity
Manufacturer

u-blox launches new ultra-compact LTE Cat 1bis cellular module to empower global connectivity

August 15, 2024
0
Shin-Etsu and SUMCO report decline in silicon wafer demand, slow market recovery
MarketWatch

Shin-Etsu and SUMCO report decline in silicon wafer demand, slow market recovery

August 15, 2024
0
33% of European auto chip revenue from China, report says
MarketWatch

33% of European auto chip revenue from China, report says

August 14, 2024
0
Microchip announces collaboration with Acacia to optimize terabit-scale data center interconnect systems
Manufacturer

Microchip announces collaboration with Acacia to optimize terabit-scale data center interconnect systems

August 14, 2024
0
Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery
MarketWatch

Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery

August 14, 2024
0

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