August 19, 2024 /SemiMedia/ -- TSMC announced that the European Semiconductor Manufacturing Company (ESMC) GmbH, a joint venture between TSMC, NXP, Bosch, and Infineon, will hold a groundbreaking ceremony in Dresden on the 20th.

TSMC pointed out that the construction plan of the ESMC wafer fab is proceeding as expected. After the groundbreaking ceremony, land leveling work will be carried out and construction is expected to start before the end of this year.

The total investment amount of ESMC exceeds 10 billion euros, with TSMC holding a 70% stake, Bosch, Infineon and NXP each holding a 10% stake.

The fab is expected to start production at the end of 2027 and will adopt TSMC's 28/22nm planar complementary metal oxide semiconductor (CMOS) and 16/12nm fin field effect transistor (FinFET) process technology, with a monthly production capacity of approximately 40,000 12-inch wafers.