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Infineon delays Kulim expansion, cuts investment as 2025 revenue outlook weakens
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Renesas releases new AnalogPAK Programmable Mixed-Signal ICs, including first low-power device with 14-bit SAR ADC
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Samsung to boost HBM capacity with new fab set for completion in 2027
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Infineon announces collaboration with Stellantis on smart EV power architecture
Manufacturer
onsemi unveils Treo Platform for advanced power and sensing solutions
Manufacturer
Murata launches SCH1633-D01, a new benchmark for automotive 6DoF sensors
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Insider: TSMC halts supply of 7nm and advanced chips to Chinese mainland AI companies
MarketWatch
ADI acquires eFPGA technology firm Flex Logix to expand digital product portfolio
MarketWatch
Nexperia and KOSTAL announce strategic partnership to advance automotive-grade wide bandgap devices
MarketWatch
Renesas introduces RA8 entry-line MCUs, bringing Arm Cortex-M85 performance to cost-sensitive applications
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