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Renesas releases new I3C bus expansion products
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IC Insights: The IC market will decline by 6% in the second quarter.
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Supply chain: Microchip will increase the price of some of its MCUs by 7%
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ECIA: Global passive component sales in 2019 decreased by 13.7% compared to 2018
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KEMET extends KC-LINK range using KONNEKT high-density packaging technology
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Infineon introduces 1700 V CoolSiC™ MOSFET to provide optimal efficiency and reduce complexity for high-voltage auxiliary power supplies
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TSMC plans to invest $2.42 billion to build IC packaging and test factory
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Samsung builds new NAND production line in South Korea
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Diodes Incorporated introduces small footprint LDO regulators that provide high PSRR for noise-sensitive applications
Manufacturer
Murata launches 6-DOF XYZ-axis gyroscope & XYZ-axis accelerometer with digital SPI interface
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