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SMIC 14nm has entered mass production stage
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TSMC plans to issue US$4 billion unsecured corporate bonds to expand production capacity
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WPG appoints new CEO
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KEMET announces new tantalum polymer capacitors for applications requiring high capacitance and high voltage
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Samsung plans to break ground on its P3 fab in Pyeongtaek in September
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JSCJ's new IC packaging and testing plant in Suqian, Jiangsu will be put into use this month
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TDK launches new ultra-high AOP analog MEMS microphone
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NXP breaks ground on expansion of IC testing center in Tianjin, China
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Infineon receives two supply awards from DENSO
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TDK launches failsafe chip varistors for automotive battery lines
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