AI chip manufacturing

Samsung to build advanced chip packaging R&D center in Yokohama

MarketWatch

Samsung to build advanced chip packaging R&D center in Yokohama

August 15, 2025

TSMC to begin construction of two US advanced packaging plants in 2028

MarketWatch

TSMC to begin construction of two US advanced packaging plants in 2028

July 11, 2025

TSMC exits GaN foundry business as Navitas shifts to PSMC

MarketWatch

TSMC exits GaN foundry business as Navitas shifts to PSMC

July 4, 2025