SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › STMicroelectronics' solution selected by Rohm for vehicle wireless charging applications
  • 0

STMicroelectronics' solution selected by Rohm for vehicle wireless charging applications

SemiMediaEdit
February 4, 2019

STMicroelectronics recently announced that its automotive NFC reader IC, ST25R3914 and its STM8AF microcontroller have been selected by Rohm for the Qi-compliant automotive wireless charging reference design.

NFC-based contactless communication has been commonly used for mobile payment functions of smart phones. In recent years, the use of NFC has rapidly expanded from mobile devices to industrial devices, Internet of Things devices and even automotive systems.

Rohm's automotive wireless charging module reference design selects the STMicroelectronics NFC reader IC and 8-bit MCU. The reference design is based on the BD57121MUF-M, a Qi standard 15W wireless charger IC developed by Rohm that aims to increase the adoption of wireless charging in the centre console of the vehicle. One benefit of STMicroelectronics technology contribution is to enable the sophisticated control that makes possible the detection of contactless smart cards in proximity to the charging system in order to halt the charging immediately.

Hiroshi Noguchi, regional manager for STMicroelectronics Japan, said: "Rohm uses ST NFC products and 8-bit microcontrollers for its Qi-standard automotive wireless charging reference design, which demonstrates that ST's extensive product lineup has great potential to create new products."

Related

electronic components news STMicroelectronics
NXP | Solution for gaming and communication
Previous
Digi-Key Greater China's sales in 2018 increased by 50% year-on-year
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
onsemi expects to produce 200mm SiC wafers by 2025
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon PSC3M/P6 MCUs Combine Four-Motor Control With Post-Quantum Firmware Security

Infineon PSC3M/P6 MCUs Combine Four-Motor Control With Post-Quantum Firmware Security

October 20, 2026
0
Murata Completes New Vietnam Production Building to Expand Coil Component Capacity

Murata Completes New Vietnam Production Building to Expand Coil Component Capacity

October 12, 2026
0
Renesas Launches First 100V E-mode GaN FET Family for AI Data Centers and Robotics

Renesas Launches First 100V E-mode GaN FET Family for AI Data Centers and Robotics

October 10, 2026
0
Vishay Launches 35W Automotive D2TO35S Power Resistor With Up to 9× Higher Dissipation

Vishay Launches 35W Automotive D2TO35S Power Resistor With Up to 9× Higher Dissipation

October 9, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator