SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › SK hynix may produce HBM outside South Korea
  • 0

SK hynix may produce HBM outside South Korea

SemiMediaEdit
May 27, 2024

May 27, 2024 /SemiMedia/ -- SK Group Chairman Chey Tae Won said in a recent interview that the company is studying the possibility of building high-bandwidth memory (HBM) factories in other countries such as Japan and the United States.

SK Hynix developed the world's first HBM chip in 2013 and currently maintains a leading position in this field. Currently, SK Hynix is increasing HBM production to meet the surge in demand for high-performance chips for artificial intelligence (AI).

Chey Tae Won said that given the additional investment required to produce HBM outside South Korea, the company is investigating the possibility of producing the product in other countries such as Japan and the United States.

Chey Tae Won said that as the world's second-largest memory chip manufacturer, its goal is to strengthen ties with Japanese chip manufacturing equipment manufacturers and chip material suppliers to produce the most advanced chips. To this end, the company will consider increasing investment in Japan and opening a new R&D base in Japan.

SK Hynix is also considering investing in its affiliates in neighboring countries, which could include Japanese memory maker Kioxia.

When selecting sites for new chip production bases, Chey Tae Won emphasized clean energy procurement as the most important factor in meeting customers' needs for decarbonization of the entire supply chain.

Chey Tae Won added that while tensions between China and the United States have increased geopolitical risks, SK Hynix has a semiconductor factory in China and plans to maintain its business in China for the foreseeable future.

Related

electronic components news Electronic components supplier Electronic parts supplier HBM chips SK Hynix
Infineon releases new NFC I2C bridge tag for contactless authentication and secure configuration of IoT devices
Previous
Vishay's new AEC-Q102 standard infrared emitter increases radiation intensity by 10% and reduces space by 20%
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

SK hynix aims to triple wafer capacity by 2034 as AI memory demand surges

SK hynix aims to triple wafer capacity by 2034 as AI memory demand surges

June 12, 2026
0
Fire reported at SK hynix Cheongju M15X fab with no casualties

Fire reported at SK hynix Cheongju M15X fab with no casualties

June 12, 2026
0
Applied Materials opens $500 million Singapore campus to expand chip equipment manufacturing

Applied Materials opens $500 million Singapore campus to expand chip equipment manufacturing

June 11, 2026
0
TSMC says price increases remain possible as inflation raises operating costs

TSMC says price increases remain possible as inflation raises operating costs

June 11, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator