SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Samsung shuts down the self-developed CPU department
  • 0

Samsung shuts down the self-developed CPU department

SemiMediaEdit
November 4, 2019

According to media reports on November 3, Samsung has given up its self-developed CPU core and will turn to ARM architecture in the future.

The report pointed out that Samsung will close the R&D department at the Austin factory and dismiss about 290 employees. The layoffs will take effect on December 31.

Samsung spokesman Michele Glaze said that the closure of the R&D team was a decision after the relevant business evaluation. The other 3,000 employees at the Austin plant will not be in the layoffs plan, and the Austin factory will not be affected. Samsung respects all employees, and employees who have been dismissed have received advance notice and received appropriate resettlement and compensation.

Michele Glaze further pointed out that this decision was made to ensure that Samsung's future business will remain competitive.

At present, Qualcomm is producing higher performance, lower power chips. In contrast, Samsung Exynos' performance is slightly inferior. If Samsung continues to use the self-developed core, the Exynos 9830 may continue to lag behind the Snapdragon 865 in benchmarking. Therefore, Samsung will use ARM's high-performance core in the Exynos SoC chip.

Related

electronic components news Samsung Austin factory Samsung close Austin factory
Diodes Incorporated introduces 40V, 2.2MHz synchronous buck converter to deliver high efficiency at all loads
Previous
Renesas and Altair Semiconductor announce collaboration for cellular IoT solutions
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Montage, Renesas and Rambus raided in South Korea price-fixing probe

Montage, Renesas and Rambus raided in South Korea price-fixing probe

July 16, 2026
0
Mainland China, Taiwan and South Korea to remain top chip equipment markets through 2028

Mainland China, Taiwan and South Korea to remain top chip equipment markets through 2028

July 16, 2026
0
Vishay introduces automotive 1 MBd high speed optocoupler

Vishay introduces automotive 1 MBd high speed optocoupler

July 15, 2026
0
PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

July 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator