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ROHM, Toshiba and Mitsubishi Electric weigh power chip tie-up

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March 30, 2026

March 30, 2026 /SemiMedia/ — ROHM is in early discussions with Toshiba and Mitsubishi Electric to combine parts of their power semiconductor businesses, according to local media reports.

The talks focus on power devices used in electric vehicles and data centers, where demand is growing but costs remain high. By working together, the companies aim to improve scale and better manage investment in new technologies such as silicon carbide.

Industry data from Omdia shows Infineon leading the global power chip market with a 17.4% share in 2024. Mitsubishi Electric, Toshiba and ROHM rank behind, and a combined operation could lift their total share close to 10%, putting them ahead of onsemi.

Separately, Denso has made an acquisition proposal for ROHM, which is now under review by a special committee. The outcome of the merger talks could affect how that proposal moves forward.

The potential deal reflects a wider push among Japanese chipmakers to strengthen their position in power semiconductors as demand rises with the shift to electric vehicles and AI infrastructure.

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