January 21, 2026 /SemiMedia/ — Japan-based semiconductor materials supplier Resonac said it will raise prices for its copper clad laminate (CCL) and prepreg products by more than 30%, with the adjustment set to take effect on March 1, 2026.

The company said tighter supply and higher prices for key inputs such as copper foil and glass cloth, along with rising labor and transportation costs, have pushed manufacturing expenses significantly higher. While Resonac has taken steps to control costs, it said the current environment makes it difficult to fully offset the increase.

Resonac added that the price revision is aimed at maintaining stable supply and supporting continued investment in new materials, particularly those used in advanced semiconductor and AI-related applications.

Resonac said it plans to continue expanding capacity to meet fast-growing AI semiconductor demand and to speed up development of materials for advanced packaging, aiming to contribute to higher chip performance through materials innovation.