SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Renesas releases R-Car V4H for automated driving Level 2+ / Level 3
  • 0

Renesas releases R-Car V4H for automated driving Level 2+ / Level 3

SemiMediaEdit
March 9, 2022

Renesas Electronics Corporation recently announced the R-Car V4H system on chip (SoC) for central processing in advanced driver-assistance (ADAS) and automated driving (AD) solutions. The R-Car V4H achieves deep learning performance of up to 34 TOPS (Tera Operations Per Second), enabling high-speed image recognition and processing of surrounding objects by automotive cameras, radar, and lidar.

The R-Car V4H enables market-leading performance per watt through a careful combination of best-in-class IP and expert HW optimization. It targets the highest volume zones of automated driving: Level 2+ and Level 3.

Thanks to a high level of integration, the R-Car V4H allows customers to develop cost-competitive, single-chip, ADAS electric control units (ECUs). These control units may support driving systems appropriate for automated driving Levels 2+ and Level 3, including full NCAP 2025 features. The R-Car V4H also supports surround view and automatic parking functions with impressive 3D visualization effects such as realistic rendering.

“We have seen excellent customer response to our R-Car V3H and V3M with high volume production, and we are pleased to extend our offering with the R-Car V4H,” said Naoki Yoshida, Vice President, Automotive Digital Products Marketing Division at Renesas. “As Renesas expands its scalable R-Car portfolio, we expect to see cutting-edge ADAS adopted in all vehicle types, from mid-range to entry-level.”

Samples of the R-Car V4H SoC are available now, with mass production scheduled for the second quarter of 2024. More information please visit renesas.com/r-car-V4H.

Related

electronic components news R-Car V4H Renesas
Vishay releases commercial and automotive grade IHLE® integrated E-Field shield inductors in 2020 case size
Previous
ADI announces €100 million investment in Europe operations
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay introduces automotive 1 MBd high speed optocoupler

Vishay introduces automotive 1 MBd high speed optocoupler

July 15, 2026
0
PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

July 15, 2026
0
Tower Semiconductor to invest $3 billion in Japan chip manufacturing

Tower Semiconductor to invest $3 billion in Japan chip manufacturing

July 15, 2026
0
Bosch begins sample production at first U.S. silicon carbide chip fab

Bosch begins sample production at first U.S. silicon carbide chip fab

July 14, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator