SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Renesas lays off 1,000 employees in Japan
  • 0

Renesas lays off 1,000 employees in Japan

SemiMediaEdit
February 5, 2019

According to the Nikkei News, Renesas Electronics will lay off nearly 1,000 employees at the end of June to cope with the shrinking domestic market.

The company will primarily provide early retirement benefits to Japanese employees, and the layoff plan is expected to focus on logistics, engineering and other employees aged 35 or older. These layoffs are equivalent to 5% of the Renesas Group's entire workforce and are the first voluntary retirement plans implemented since December 2014.

The crisis caused by the earthquake and tsunami in March 2011 has had a great impact on Renesas. Although the company has been profitable every year since FY2014, the restructuring is still going on. For example, the plan announced in June 2018, according to the plan, Renesas will close the Yamaguchi Prefecture factory within two to three years.

Renesas has used the acquisition to establish overseas operations, including the acquisition of US chipmaker Intersil in February 2017. The chip maker announced last September that it would acquire another US company, Integrated Device Technology, for $6.7 billion. Although the US government partially closed the review process, Renesas is expected to complete the transaction in the first half of 2019.

Related

electronic components news Renesas Electronics
Texas Instruments | Connect: Zigbee + Amazon Echo Demo
Previous
Diodes Inc. announces acquisition of TI’s fab
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator