SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Rapidus to produce AI chips for Tenstrent, report says
  • 0

Rapidus to produce AI chips for Tenstrent, report says

SemiMediaEdit
November 17, 2023

November 17, 2023 /SemiMedia/ -- According to reports, Japanese semiconductor company Rapidus has reached a cooperation with Canadian start-up chip company Tenstrent to manufacture AI chips for it.

Tenstorrent was founded in 2016 by Jim Keller, a well-known engineer in the semiconductor industry.

Rapidus President Atsuyoshi Koike said that he plans to open a sales office in Silicon Valley in the United States by the end of March 2024, which will help establish contact with customers before mass production and hopes to expand business globally. Rapidus aims to mass-produce 2nm process chips in Japan in 2027 and is currently seeking cooperation in the industry chain.

Rapidus' 2nm chip R&D/production base in Hokkaido, Japan, started construction in September. The trial production line is scheduled to be launched in April 2025, with the goal of starting mass production in 2027.

Related

electronic components news Electronic components supplier Electronic parts supplier Rapidus Tenstrent
Diodes releases low-power 1.8V, 2.5Gbps, two data lane redriver supporting MIPI D-PHY 1.2 protocols
Previous
Infineon’s revenue in fiscal year 2023 increases by 15% year-on-year
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator