SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Powerchip ends partnership with SBI on new chip fab
  • 0

Powerchip ends partnership with SBI on new chip fab

SemiMediaEdit
September 30, 2024

September 30, 2024 /SemiMedia/ — Powerchip Semiconductor has decided to terminate its partnership with Japan's SBI Holdings on the planned new semiconductor plant, according to a report by Nikkei. Powerchip confirmed it has halted the collaboration and has informed both Japan’s Ministry of Economy, Trade and Industry (METI) and SBI Holdings of its decision.

The partnership with SBI was structured under a FabIP model, where Powerchip would provide consultancy services, staff training, and technology transfer, while receiving service fees and royalties from the Japanese partner. Powerchip had no plans to take equity or play a leading role in the operation of the new plant.

SBI had applied for subsidies from METI and received support from the Japanese government. However, METI’s subsidy conditions required the new plant to guarantee continuous production for over 10 years. Since SBI, a financial firm, lacks semiconductor industry experience, METI insisted that Powerchip share the guarantee responsibility.

Powerchip, a publicly listed company in Taiwan, stated that guaranteeing the operations of a plant it does not control would violate Taiwan's securities regulations. As a result, Powerchip’s board resolved to terminate the partnership several months ago, notifying METI and SBI of its decision.

Related

electronic components news Electronic components supplier Electronic parts supplier UK Semiconductor
UK buys Coherent wafer fab for £20 million
Previous
Kingston cuts prices as mid-tier memory market faces inventory pressure
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator