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SIA: Global semiconductor sales increased 18.3% year-on-year in the second quarter
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024
onsemi expects to produce 200mm SiC wafers by 2025
AMD expects AI chip supply to be tight until 2025
Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery
SemiMedia - Electronic Component Industry News & Insights
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ASE to expand semiconductor packaging capacity in Malaysia and Kaohsiung
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U.S. pushes for Intel and TSMC joint venture for chip foundries
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Arm to launch in-house chips in 2025
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Micron to begin mass production of 12-layer stack HBM for Nvidia
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SEMI: Global silicon wafer market to bottom out in 2024, strong recovery expected in H2 2025
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Western Digital and SanDisk to finalize split
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South Korean foundries see utilization rates surge on China-driven demand
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China's chip manufacturing equipment procurement to decline in 2025
Manufacturer
Infineon releases new industrial CoolSiC™ MOSFETs 650 V G2 with improved power density in Q-DPAK and TOLL packages.
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Sumco to end 200mm wafer production at Miyazaki plant by 2026
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