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SIA: Global semiconductor sales increased 18.3% year-on-year in the second quarter
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024
onsemi expects to produce 200mm SiC wafers by 2025
AMD expects AI chip supply to be tight until 2025
Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery
SemiMedia - Electronic Component Industry News & Insights
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KEMET extends KC-LINK range using KONNEKT high-density packaging technology
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Infineon introduces 1700 V CoolSiC™ MOSFET to provide optimal efficiency and reduce complexity for high-voltage auxiliary power supplies
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TSMC plans to invest $2.42 billion to build IC packaging and test factory
MarketWatch
Samsung builds new NAND production line in South Korea
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Diodes Incorporated introduces small footprint LDO regulators that provide high PSRR for noise-sensitive applications
Manufacturer
Murata launches 6-DOF XYZ-axis gyroscope & XYZ-axis accelerometer with digital SPI interface
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ON Semiconductor | History with Discrete Solutions
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Vishay lowers TCR for TNPU e3 series ultra precision thin film flat chip resistors in 0603, 0805, and 1206 case sizes
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ASML announces new semiconductor equipment can increase production capacity by 600%
MarketWatch
SK Hynix returns to the top five in the NAND global ranking
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