SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Murata headquarters reported a COVID-19 case
  • 0

Murata headquarters reported a COVID-19 case

SemiMediaEdit
October 9, 2020

Yesterday, Murata Manufacturing Co., Ltd. issued an announcement stating that an employee of its partner companies working at Murata Headquarters had tested positive for COVID-19.

Murata said that the employee had showed symptoms since the October 3rd, so the employee visited a medical institution for test and tested positive on October 6th. It has been confirmed that there were no close contacts within the company.

To prevent infection with and minimize the spread of COVID-19, Murata sterilized the area and facilities where the employee worked.

According to Murata, the Covid-19 case did not affect the operations of its headquarters.

Related

electronic components news Murata Covid-19
AMD said to be in talks to acquires Xilinx
Previous
Renesas releases Arm Cortex-M33-based RA6M4 MCUs for IoT applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

VIS sees stronger second-half demand as foundry capacity remains fully utilized

VIS sees stronger second-half demand as foundry capacity remains fully utilized

June 1, 2026
0
TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
0
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator