SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › NXP appoints Dr. Li Tingwei as Chairman of Greater China
  • 0

NXP appoints Dr. Li Tingwei as Chairman of Greater China

SemiMediaEdit
February 10, 2020

NXP Semiconductors today announced the appointment of Dr. Li Tingwei as Chairman of NXP Greater China.

According to the announcement, Dr. Li Tingwei will be fully responsible for various affairs of NXP China and related external affairs in Greater China. On behalf of NXP, he will actively engage with government agencies to promote key work, and will work with local management teams to further deepen and expand NXP ecosystems in Greater China.

Dr. Li Tingwei has extensive industry experience and has held senior management positions in a number of high-tech companies including Gore, Broadcom, Marvell, and Qualcomm, and has achieved great results during his tenure. Dr. Li Tingwei holds a PhD degree in experimental physics from Leiden University in the Netherlands.

Steve Owen, NXP's Executive Vice President of Global Sales and Marketing, said: "We welcome very experienced leaders like Dr. Li to join the NXP team. Dr. Li has a deep understanding of the business and industry environment in Greater China and will play an important role in maintaining our strong development momentum in China. I believe that with the further strengthening of China's management team and overall strength, NXP will create more value for the industry in the era of autonomous driving and artificial intelligence."

Related

electronic components news Li Tingwei NXP NXP Chairman of Greater China
Global electronics makers' semiconductor purchases in 2019 down 11.9% annually
Previous
Murata's Shenzhen site postponed resumption of work due to the novel coronavirus outbreak
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay introduces automotive 1 MBd high speed optocoupler

Vishay introduces automotive 1 MBd high speed optocoupler

July 15, 2026
0
PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

July 15, 2026
0
Tower Semiconductor to invest $3 billion in Japan chip manufacturing

Tower Semiconductor to invest $3 billion in Japan chip manufacturing

July 15, 2026
0
Bosch begins sample production at first U.S. silicon carbide chip fab

Bosch begins sample production at first U.S. silicon carbide chip fab

July 14, 2026
0
2
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator