SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Nikkei: Taiyo Yuden plans to reduce capacity utilization in response to shrinking orders
  • 0

Nikkei: Taiyo Yuden plans to reduce capacity utilization in response to shrinking orders

SemiMediaEdit
August 5, 2022

According to Nikkei, Taiyo Yuden's orders fell sharply last quarter and shrank for four consecutive quarters. It is rumored that it is considering lowering the MLCC capacity utilization rate this quarter.

The report pointed out that the revenue of Taiyo Yuden MLCC increased by 2.6% to 54.583 billion yen compared with the same period last year, the revenue of inductors increased by 3.2% to 11.748 billion yen, and the revenue of composite components decreased by 34.5% to 9.159 billion yen. Other departments Revenue from products including aluminum electrolytic capacitors and energy components rose 18.7% to 6.248 billion yen.

Taiyo Yuden pointed out that the amount of orders received in the last quarter fell by 29% to 71.6 billion yen compared with the same period last year, which was the fourth consecutive quarter of decline. Among them, the order value of the capacitor department dropped by 30% to 47 billion yen.

The report revealed that Taiyo Yuden is considering reducing the capacity utilization rate of capacitors (MLCCs) for July-September 2022 to around 85% from the 95% announced in May.

Related

electronic components news MLCC market Nikkei Taiyo Yuden
Infineon introduces new HYPERRAM™ memory chips, doubling bandwidth while achieving low pin count
Previous
Vishay's facility in Borgaro Turin, Italy receives R&D funding for SiLA project
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator