SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Nexperia launches high efficiency and reliability 650V ultra-fast recovery rectifiers in D2PAK Real-2-Pin package
  • 0

Nexperia launches high efficiency and reliability 650V ultra-fast recovery rectifiers in D2PAK Real-2-Pin package

SemiMediaEdit
July 11, 2024

July 11, 2024 /SemiMedia/ -- Nexperia recently announced 650V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic (PV), inverters, servers and switched mode power supplies (SMPS).

Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D2PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D2PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25mm to over 4mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard.

“These recovery rectifiers further demonstrate Nexperia’s expertise in the field of semiconductor device packaging” according to Frank Matschullat, Head of Product Group Power Bipolar Discretes at Nexperia. “By taking the innovative step of removing the cathode pin from a standard D2PAK package, Nexperia has created a Real-2-Pin package that can meet the creepage and clearance requirements, in particular for high voltage automotive applications.”

To learn more about Nexperia’s portfolio of recovery rectifiers, visit: https://www.nexperia.com/products/diodes/recovery-rectifiers

Related

650V rectifier electronic components news Electronic components supplier Electronic parts supplier Nexperia
TechInsights: Global semiconductor sales are expected to exceed $1 trillion in 2030
Previous
AMD acquires AI startup Silo AI
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Amkor reportedly considers sale of stake in China business

Amkor reportedly considers sale of stake in China business

August 11, 2026
0
SK hynix says no decision made on reported Chongqing plant stake sale

SK hynix says no decision made on reported Chongqing plant stake sale

August 11, 2026
0
Diodes to acquire ElevATE Semiconductor for $250 million

Diodes to acquire ElevATE Semiconductor for $250 million

August 11, 2026
0
Chinese foundries expand share of global mature-node chip production

Chinese foundries expand share of global mature-node chip production

August 10, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator