SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Murata announces ISO 26262 certification for functional safety in automotive applications
  • 0

Murata announces ISO 26262 certification for functional safety in automotive applications

SemiMediaEdit
May 22, 2024

May 22, 2024 /SemiMedia/ -- Murata Manufacturing Co., Ltd. announced that it has received ISO 26262 ISO 26262 development process certification for functional safety automotive from German third-party certification body SGS-TÜV Saar GmbH on February 13, 2024. The official certification ceremony was held on May 21 at Murata Manufacturing’s headquarters in Kyoto, Japan.

This certification validates that Murata’s development process for hardware and software, as well as systems integrating them, complies with Automotive Safety Integrity Level (ASIL) D, the highest level of safety defined by ISO 26262. This enables Murata to supply highly reliable functional safety products, including communication modules and sensors, based on its development process.

The safety performance needs of automobiles have increased in recent years with the popularization of automatic driving. Accordingly, automotive components and software are also required to provide a high level of safety performance.

ISO 26262 is an international standard for the functional safety of electrical and electronic equipment installed in road vehicles. The certification recognizes Murata’s development process as capable of complying with ASIL D, the highest of the four safety levels defined by ISO 26262. This means that Murata’s development process meets a high level of safety suitable even for systems such as airbags and electric power steering, for which malfunction is associated with high risks.

Related

electronic components news Electronic components supplier Electronic parts supplier Murata ISO 26262
Marvell accelerates growth in Vietnam
Previous
Melexis launches MLX90427 position sensing for steer-by-wire
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator