SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron raises 2024 capex forecasts to increase investment in HBM
  • 0

Micron raises 2024 capex forecasts to increase investment in HBM

SemiMediaEdit
May 23, 2024

May 23, 2024 /SemiMedia/ -- According to reports, Micron Technology has raised its capital expenditure forecast for 2024 to increase investment in the production of high-bandwidth memory (HBM) semiconductors to meet the growing needs of the artificial intelligence (AI) industry.

Micron Chief Financial Officer Matt Murphy said recently that the company will raise its 2024 capital expenditure forecast to about $8 billion from the previous $7.5 billion.

Micron Technology is one of the three major suppliers of HBM chips, which are an important part of the hardware used in artificial intelligence servers. Micron's advanced HBM3E will be used in Nvidia's H200 chip.

Micron has previously stated that HBM chip production capacity has been sold out in 2024, and most of the available production capacity in 2025 has also been allocated. Micron currently offers 8-layer HBM and has begun providing 12-layer HBM samples.

"By fiscal 2025, we expect HBM to become a multi-billion dollar business." Micron COO Manish Bhatia said.

Related

electronic components news Electronic components supplier Electronic parts supplier Micron HBM
Melexis launches MLX90427 position sensing for steer-by-wire
Previous
Allegro releases new isolated gate driver products
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator