SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron plans to build a new factory for DRAM
  • 0

Micron plans to build a new factory for DRAM

SemiMediaEdit
September 8, 2020

According to media reports, Micron plans to submit an application for the construction of the A5 factory in 2021, which will be used for DRAM production.

The construction plan of Micron A5 factory shows that Micron is optimistic about the future market trend of DRAM. However, Micron has not disclosed the details of the plan for the A5 factory.

According to statistics, in the second quarter of 2020, global DRAM sales totaled US$17.06 billion, an increase of 15% month-on-month and 16% year-on-year. Samsung, SK Hynix and Micron together accounted for more than 95% of the market. Among them, Micron's market share accounted for 21.2%, ranking third. Therefore, there is no doubt that Micron's DRAM expansion will have a profound impact on the market.

However, because the A5 factory plans to start construction in 2021, and the estimated time to put into operation is 2022, the impact on the DRAM market in the short term is limited.

Related

DRAM market electronic components news Micron A5 Micron DRAM
Renesas releases 15W wireless power receiver featuring WattShare TRx mode
Previous
Murata | EV fast charging applications can benefit from Murata’s HPHF transformer designs
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

VIS sees stronger second-half demand as foundry capacity remains fully utilized

VIS sees stronger second-half demand as foundry capacity remains fully utilized

June 1, 2026
0
TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
0
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator