SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron announces the industry’s first shipment of key memory products for AI data centers
  • 0

Micron announces the industry’s first shipment of key memory products for AI data centers

SemiMediaEdit
May 13, 2024

May 13, 2024 /SemiMedia/ -- Micron announced on May 9 that it would be the first to ship key memory products for AI data centers. Micron is the first in the industry to verify and ship 128GB DDR5 RDIMM memory based on a large-capacity 32Gb single DRAM chip, with a speed of up to 5600 MT/s on all mainstream server platforms.

Micron pointed out that this 128GB DDR5 RDIMM memory uses Micron's 1β process technology. Compared with competing products using 3DS through silicon via (TSV) technology, the capacity density is increased by more than 45%, the energy efficiency is improved by up to 22%, and the latency is reduced by up to 16%.

This high-speed memory module is specifically targeted at mission-critical applications common in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDB) and scenarios that require efficient processing of multi-threaded and multi-core general computing workloads to meet their performance needs.

Micron's 128GB DDR5 RDIMM memory module has received strong ecological support, including AMD, HPE, Intel, Supermicro and other companies.

Related

electronic components news Electronic components supplier Electronic parts supplier MICRON
Infineon announces austerity measure
Previous
Microchip launches radiation-hardened DC-DC 50W power converters to provide high-reliability solution for new space applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator