SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Lattice announces price increase for 2025 on select FPGA products
  • 0

Lattice announces price increase for 2025 on select FPGA products

SemiMediaEdit
December 23, 2024

December 23, 2024 /SemiMedia/ — Lattice Semiconductor has informed customers of a 10% price increase on certain product families, effective for deliveries starting January 27, 2025. The affected products include the MachXO™, MachXO2™, MachXO3™, MachXO3D™, Power Manager, Platform Manager™, ASC, ispMACH™ 4000V/ZC/ZE, ECP2/m™, ECP3™, XP2™, ECP5™, ICE40™, CrossLink™, CrossLinkPlus™, HDMI, and MHL series.

The company cited rising supply chain costs as the reason for the adjustment, while reiterating its commitment to providing extended product lifecycles to help customers avoid costly redesigns due to product discontinuation.

Lattice clarified that the price increase does not apply to newer product families expected to remain available for over 20 years, including Certus™-NX, Certus Pro™-NX, CrossLink™-NX, CrossLinkU™-NX, Mach-NX™, MachXO5™-NX, and Avant™.

To mitigate the impact of the price hike, Lattice recommended customers consider placing orders at current prices for delivery before January 27, 2025, or transitioning to unaffected product families such as Certus™-NX or Avant™.

Lattice emphasized its focus on innovation in small to mid-range, low-power FPGAs and its commitment to delivering competitive solutions for diverse applications and markets.

Related

electronic components news Electronic components supplier Electronic parts supplier Lattice raises price
TI announces award agreement for CHIPS and Science Act funding
Previous
Microchip launches MTCH2120 12-button touch controller, simplifying user interface design
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Bosch begins sample production at first U.S. silicon carbide chip fab

Bosch begins sample production at first U.S. silicon carbide chip fab

July 14, 2026
0
Intel to invest €5 billion in Ireland chip manufacturing expansion

Intel to invest €5 billion in Ireland chip manufacturing expansion

July 14, 2026
0
UMC begins advanced photonic chip production in Singapore

UMC begins advanced photonic chip production in Singapore

July 14, 2026
0
Infineon launches SECORA ID Key S USB for passwordless authentication

Infineon launches SECORA ID Key S USB for passwordless authentication

July 13, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator