SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › JIP consortium launches 2 trillion yen acquisition of Toshiba
  • 0

JIP consortium launches 2 trillion yen acquisition of Toshiba

SemiMediaEdit
August 11, 2023

August 11, 2023 /SemiMedia/ -- According to reports, on August 8, the public tender offer initiated by a consortium led by Japan Industrial Partners (JIP) to Toshiba was officially launched.

A consortium dominated by JIP will officially launch a tender offer for Toshiba with a total amount of about 2 trillion yen. The consortium, made up of more than 20 Japanese companies, will buy Toshiba shares at a price of 4,620 yen per share. So far, semiconductor manufacturer ROHM has announced that it will invest 300 billion yen, and ORIX has announced that it will invest 200 billion yen.

The tender offer will close on Sept. 20, when the bid will be successful if the acquirer buys more than two-thirds of Toshiba shares.

Toshiba's board expressed support for the tender offer. Akihiro Watanabe, chairman of the board, called on shareholders to accept the offer at a press conference, vowing to transform the company through delisting.

Related

electronic components news Electronic components supplier Electronic parts supplier JIP Toshiba
Allegro announces acquisition of Crocus Technology
Previous
Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for high-power ECUs
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator