SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel to begin high-volume 3nm chip production at Ireland's Fab 34
  • 0

Intel to begin high-volume 3nm chip production at Ireland's Fab 34

SemiMediaEdit
March 31, 2025

March 31, 2025 /SemiMedia/ — Intel plans to commence high-volume manufacturing (HVM) of 3nm (Intel 3) chips at its Fab 34 facility in Leixlip, Ireland, in 2025. This marks the company's second major production site for the node, following its Oregon operations, as it expands its advanced process technology footprint globally.

Intel 3, the company’s second-generation EUV node, delivers an 18% performance-per-watt improvement over Intel 4. The process is available for foundry customers and is being used to manufacture next-generation Xeon 6 scalable server processors. Given Europe's limited access to cutting-edge semiconductor technology, Intel sees its Intel 3 foundry services as a key competitive advantage.

To fund its expansion, Intel sold part of Fab 34 to private equity firm Apollo last year. The company is also advancing multiple foundry nodes, including Intel 4, Intel 3, and Intel 18A, while co-developing a 12nm process with UMC. In 2025, Intel aims to begin HVM of its Panther Lake processors on the Intel 18A node at its Arizona facilities, with Intel 14A expected to launch in 2026.

However, Intel’s European expansion faces hurdles, as its planned wafer fab in Magdeburg, Germany, and packaging plant in Poland remain on hold. Additionally, following the ousting of Pat Gelsinger in 2024, new CEO Justin Hotard’s strategy for Intel’s advanced manufacturing and foundry business remains under close watch.

Related

electronic components news Electronic components supplier Electronic parts supplier High-volume manufacturing Intel Intel 18A and 14A nodes Intel 3 process technology Intel 3nm chip production Intel EUV lithography Intel Fab 34 Ireland Intel foundry expansion Intel foundry services Intel semiconductor roadmap Xeon 6 server processors
Renesas introduces highly integrated LCD video processor that enables next-generation ASIL B automotive display systems
Previous
SK Hynix completes $8.85 billion acquisition of Intel’s NAND business
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator